Cadence releases new AuraStack AI Super Agent dedicated to PCB and packaging design
Cadence has officially announced the latest agentic AI platform, the AuraStack AI Super Agent designed for PCB and advanced packaging design that takes designers from system planning through to a finished product in one AI-native environment.
Accelerated by NVIDIA Blackwell and CUDA-X, AuraStack coordinates domain-specific AI agents across planning, implementation, and multiphysics analysis to compress the system design cycle all the way through manufacturing. Built on the same architecture as Cadence’s ChipStack AI Super Agent, AuraStack pairs agentic AI with simulation and optimization tools that work from a model of the design intent to automate and coordinate design exploration, realization, and signoff.
It brings together automation across system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability, and multiphysics analysis across Cadence’s system design and analysis tools. A unified AI-driven multiphysics foundation models and optimizes electrical, thermal, and mechanical behavior together, including signal and power integrity, thermal, mechanical stress, drop, vibration, and fatigue analysis, within a closed-loop setup that allows earlier tradeoff evaluation and lets engineers catch design issues before they become late-stage problems.
The firm points to several benefits from the new system, including up to 2x faster time to market with 15x productivity gains driven by multiphysics-informed quality, a shared design environment that unifies previously separate engineering teams around a single source of truth, continuous multiphysics co-optimization that cuts down on late-stage rework, and integration across Cadence’s existing signoff tools like the Celsius Thermal Solver, Clarity 3D Solver, MSC Nastran and Marc finite element analysis solvers, and the Sigrity X platform for signal and power integrity.
Cadence says the approach also limits costly respins by catching system-level issues earlier and supports product-level optimization, including co-optimization with advanced packaging strategies.
