Taiwan joins SEMICON SEA 2026 to showcase world-class examples in semiconductor industry
Malaysia is growing into a key global hub for semiconductor packaging and testing, making it an important partner for Taiwan’s supply chain. To strengthen this partnership, the Taiwan International Trade Administration (TITA), along with the Precision Machinery Research & Development Center (PMC) and the Taiwan External Trade Development Council (TAITRA), is hosting the ‘Taiwan Semiconductor Innovative Products Launch’ at SEMICON SEA 2026, slated for May 5 – 7.
Various sessions will be covered in terms of semiconductor packaging, testing, and automation solutions, highlighting Taiwan’s capabilities in AI- and HPC-driven technologies.
Participating companies are showcasing comprehensive solutions across the sector. In advanced packaging and process technologies, vendors are presenting solutions for AI and HPC integration, SiP EMI shielding, plasma etching, and advanced metrology. Other offerings include full-range thermal control systems and plasma solutions.
For core components and smart manufacturing, participants are demonstrating high-precision aerostatic spindles, leak-free fittings, custom sheet metal components, and integrated smart factory systems. Additional specialized solutions cover energy-saving vacuum systems, high-purity nitrogen generation, low-pollution laser film removal, and automated photomask storage with RFID management.
The launch aims to solidify ties between Taiwan and the SEA region, working together to build a more competitive regional semiconductor ecosystem.
